Services

Contract electronics manufacturing

Full-cycle production of electronic devices to your documentation, from component procurement to finished goods.

Illustration of SMT component placement

Scope of work

  • Procurement of components and materials
  • SMT assembly from 0201 to BGA 52×52 mm
  • THT assembly and manual soldering
  • AOI optical inspection
  • Electrical and functional testing
  • Final assembly into enclosures and packaging

Volumes

  1. Prototypes from 10 pieces
  2. Small and medium batches
  3. Serial production up to 10,000 pieces and more

Capabilities

From the smallest chip to the largest BGA

We place components across the full size range and scale from a prototype to a series.

Package size range

0201
0402
0603
0805
1206
SOIC
QFN
QFP
BGA 52×52

Batch size, pieces

10
Prototype
100
Pilot batch
1 000
Small series
10 000
Serial production

Have a project?

Send us your technical documentation and we will prepare a commercial proposal within two business days.